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1

Laser processing for microelectronics packaging applications

Zsolt Illyefalvi-Vitéz

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 886 KB

english, 2001

2

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

Geczy, Attila, Kiss, Balazs Peter, Alaya, Amine Mohamed, Illyefalvi-Vitez, Zsolt

Year:

2019

Language:

english

File:

PDF, 1.11 MB

english, 2019

3

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering

Geczy, Attila, Kvanduk, Biborka, Illes, Balazs, Illyefalvi-Vitez, Zsolt

Year:

2012

Language:

english

File:

PDF, 421 KB

english, 2012

4

Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory

Géczy, Attila, Illés, Balázs, Illyefalvi-Vitéz, Zsolt

Journal:

International Journal of Heat and Mass Transfer

Year:

2013

Language:

english

File:

PDF, 879 KB

english, 2013

5

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Euro training courses of microsystems technology and nanotechnology for electronics

Batorfi, Reka, Illyefalvi-Vitez, Zsolt, Wendin, Goran, Heinzelmann, Harry, Demarchi, Danilo, Civera, Pierluigi

Year:

2010

Language:

english

File:

PDF, 299 KB

english, 2010

6

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigating PCB traces for fine pitch applications

Geczy, Attila, Illyefalvi-Vitez, Zsolt

Year:

2010

Language:

english

File:

PDF, 412 KB

english, 2010

7

[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Soldering profile optimization for vapour phase reflow technology

Geczy, Attila, Szoke, Peter, Illyefalvi-Vitez, Zsolt, Ruszinko, Miklos, Bunea, Radu

Year:

2011

Language:

english

File:

PDF, 1.07 MB

english, 2011

8

[IEEE 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Pilsen, Czech Republic (2016.5.18-2016.5.22)] 2016 39th International Spring Seminar on Electronics Technology (ISSE) - MicroElectronics Cloud Alliance (MECA) — Presentation of a new Erasmus+ project

Illyefalvi-Vitez, Zsolt, Krammer, Oliver, Tzanova, Slavka

Year:

2016

Language:

english

File:

PDF, 646 KB

english, 2016

9

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems

Geczy, Attila, Peter, Zsolt, Illes, Balazs, Illyefalvi-Vitez, Zsolt

Year:

2012

Language:

english

File:

PDF, 588 KB

english, 2012

10

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Graphene and its potential applications in electronics packaging - A review

Illyefalvi-Vitez, Zsolt

Year:

2013

Language:

english

File:

PDF, 702 KB

english, 2013

11

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Laser Manufacturing of Mechanical Structures in Flexible Substrates for Lifetime Increasing

Berenyi, Richard, Juhasz, Gabor, Illyefalvi-Vitez, Zsolt

Year:

2006

Language:

english

File:

PDF, 7.52 MB

english, 2006

12

[IEEE Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan (2007.01.16-2007.01.18)] Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Life-time Tests of Lead-free Solder Joints on Flexible Printed Circuits

Illyefalvi-Vitez, Zsolt, Balogh, Balint, Farmer, Graham, Girulska, Anna, Kirkpatrick, Damien

Year:

2007

Language:

english

File:

PDF, 4.92 MB

english, 2007

13

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Experimental investigations on the vapor phase soldering process

Illyefalvi-Vitez, Zsolt, Geczy, Attila, Szoke, Peter, Batorfi, Reka, Torzsok, Istvan

Year:

2010

Language:

english

File:

PDF, 394 KB

english, 2010

14

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Evaluation of solder joints formed by different Vapour Phase Soldering systems

Peter, Zsolt, Geczy, Attila, Rigler, Daniel, Ruszinko, Miklos, Illyefalvi-Vitez, Zsolt

Year:

2013

Language:

english

File:

PDF, 1.37 MB

english, 2013

15

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Process parameter optimization of selective soldering

Olah, Zoltan, Ruszinko, Miklos, Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2012

Language:

english

File:

PDF, 814 KB

english, 2012

16

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - 3D thermal profiling of an experimental Vapour Phase Soldering Station

Geczy, Attila, Peter, Zsolt, Illyefalvi-Vitez, Zsolt

Year:

2011

Language:

english

File:

PDF, 860 KB

english, 2011

17

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pressure measurements in a batch type Vapour Phase Soldering Station

Peter, Zsolt, Geczy, Attila, Illes, Balazs, Illyefalvi-Vitez, Zsolt

Year:

2012

Language:

english

File:

PDF, 331 KB

english, 2012

18

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Optimizing technological process for laser soldering of fine-pitch flip chips

Batorfi, Reka, Illyefalvi-Vitez, Zsolt, Krammer, Oliver, Bunea, Radu, Svasta, Paul

Year:

2009

Language:

english

File:

PDF, 1.81 MB

english, 2009

19

[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Evaluating vapor phase soldering for fine pitch BGA

Geczy, Attila, Batorfi, Reka, Gal, Laszlo, Illyefalvi-Vitez, Zsolt, Szoke, Peter

Year:

2010

Language:

english

File:

PDF, 1.58 MB

english, 2010

20

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Mechanical and structural analysis of thermosonic wire bonds

Szecsenyi, Janos, Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2012

Language:

english

File:

PDF, 756 KB

english, 2012

21

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Mechanical properties of thermosonic thin gold wire bonds

Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2011

Language:

english

File:

PDF, 970 KB

english, 2011

22

[IEEE 2006 29th International Spring Seminar on Electronics Technology - St. Marienthal, Germany (2006.05.10-2006.05.14)] 2006 29th International Spring Seminar on Electronics Technology - LEADOUT Training Course on Pb-free Soldering

Illyefalvi-Vitez, Zsolt, Mason, Simon, Freitas, Marta

Year:

2006

Language:

english

File:

PDF, 633 KB

english, 2006

23

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Modeling of condensation heating during Vapour Phase Soldering

Geczy, Attila, Illes, Balazs, Illyefalvi-Vitez, Zsolt

Year:

2013

Language:

english

File:

PDF, 664 KB

english, 2013

24

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Analysis of vapor phase soldering in comparison with conventional soldering technologies

Illyefalvi-Vitez, Zsolt, Geczy, Attila, Batorfi, Reka, Szoke, Peter

Year:

2010

Language:

english

File:

PDF, 1.67 MB

english, 2010

25

[IEEE 2009 EAEEIE Annual Conference - Valencia, Spain (2009.06.22-2009.06.24)] 2009 EAEEIE Annual Conference - The nanoelectronics training roadmap of Euro Training

Illyefalvi-Vitez, Zsolt, Fanet, Herve

Year:

2009

Language:

english

File:

PDF, 1.19 MB

english, 2009

26

[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Defect analysis of ultrasonic al wire bonds on Ni-plated package leads

Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2011

Language:

english

File:

PDF, 787 KB

english, 2011

27

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Laser soldering of small pitch BGAs on Plexiglas substrate PCBs

Bunea, Radu, Balogh, Balint, Batorfi, Reka, Illyefalvi-Vitez, Zsolt, Svasta, Paul, Kovacs, Robert, Nagynemedi, Csaba, Rigler, Daniel

Year:

2009

Language:

english

File:

PDF, 1.64 MB

english, 2009

28

[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Foreword

Illyefalvi-Vitez, Zsolt

Year:

2009

Language:

english

File:

PDF, 10 KB

english, 2009

29

[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Life-time test of laser and reflow soldered flexible substrates

Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2008

Language:

english

File:

PDF, 414 KB

english, 2008

30

[IEEE 2007 30th International Spring Seminar on Electronics Technology - Cluj-Napoca, Romania (2007.5.9-2007.5.13)] 2007 30th International Spring Seminar on Electronics Technology (ISSE) - Laser Soldering for Lead-free Assembly

Illyefalvi-Vitez, Zsolt, Balogh, Balint, Baranyay, Zsolt, Farmer, Graham, Harvey, Tom, Kirkpatrik, Damien, Kotora, Gyorgy, Ruzsics, Norbert

Year:

2007

Language:

english

File:

PDF, 2.07 MB

english, 2007

31

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Effect of Component-Level Heat Conduction on Reflow Soldering Failures

Illes, Balazs, Krammer, Oliver, Harsanyi, Gabor, Illyefalvi-Vitez, Zsolt, Szabo, Andras

Year:

2006

Language:

english

File:

PDF, 6.82 MB

english, 2006

32

[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Selective laser soldering on flexible boards using through foil heating

Baranyay, Zsolt, Illyefalvi-Vitez, Zsolt, Balogh, Balint

Year:

2008

Language:

english

File:

PDF, 618 KB

english, 2008

33

[IEEE 2006 29th International Spring Seminar on Electronics Technology - St. Marienthal, Germany (2006.05.10-2006.05.14)] 2006 29th International Spring Seminar on Electronics Technology - Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens

Illes, Balazs, Krammer, Oliver, Harsanyi, Gabor, Illyefalvi-Vitez, Zsolt

Year:

2006

Language:

english

File:

PDF, 330 KB

english, 2006

34

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate

Geczy, Attila, Lener, Vilmos, Hajdu, Istvan, Illyefalvi-Vitez, Zsolt

Year:

2011

Language:

english

File:

PDF, 561 KB

english, 2011

35

[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Package–on–Package – Review on a Promising Packaging Technology

Geczy, Attila, Illyefalvi-Vitez, Zsolt

Year:

2010

Language:

english

File:

PDF, 949 KB

english, 2010

36

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Investigating the effect of chip component misalignment on its solder joint mechanical strength

Krammer, Oliver, Illyefalvi-Vitez, Zsolt

Year:

2009

Language:

english

File:

PDF, 1.75 MB

english, 2009

37

[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Optimizing laser soldering of SMD components: From theory to practice

Bunea, Radu, Svasta, Paul, Illyefalvi-Vitez, Zsolt, Batorfi, Reka, Geczy, Attila

Year:

2011

Language:

english

File:

PDF, 751 KB

english, 2011

38

Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

Géczy, Attila, Illés, Balázs, Péter, Zsolt, Illyefalvi-Vitéz, Zsolt

Journal:

Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 969 KB

english, 2015

39

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Testing the Impact of Pb-free Soldering on Reliability

Illyefalvi-Vitez, Zsolt, Krammer, Oliver, Pinkola, Janos

Year:

2006

Language:

english

File:

PDF, 6.52 MB

english, 2006

40

SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Laser applications in the field of MEMS

Moagar-Poladian, Gabriel M., Illyefalvi-Vitez, Zsolt, Balogh, Balint, Ulieru, Dumitru, Coraci, Antonie, Udrea, Mircea

Year:

2012

Language:

english

File:

PDF, 284 KB

english, 2012

41

[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Teaching electronics assembling, inspection and test technologies in Elect2EAT

Batorfi, Reka, Illyefalvi-Vitez, Zsolt

Year:

2009

Language:

english

File:

PDF, 8.35 MB

english, 2009

42

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Building a cloud platform for education in microelectronics

Martinek, Peter, Illyefalvi-Vitez, Zsolt, Krammer, Oliver, Geczy, Attila, Villanyi, Balazs, Illes, Balazs, Kaman, Judit, Tzanova, Slavka

Year:

2017

Language:

english

File:

PDF, 451 KB

english, 2017